The electronic modules are equipped with SMD and THD technology on the basis of the Electronic Equipment Law RoHS or non-RoHS-compliant as well as on the basis of the requirement specifications of our customers. Exceptions for certain, mostly safety-related industries are possible and often require the leaded version (non-RoHS).
Special technology solutions such as conductive adhesion, pin in paste (THR), selective soldering, press-in technology are integrated in the production process if needed.
Our production documents ensure a 100% repeat accuracy in connection with the existing technology. The electronics manufacturing is designed for prototype manufacturing and small series (1 to 100 pieces), medium-sized series (500 to 1,000 pieces) and series (10,000 pieces and more). In total, the mounting capacity is 15,000 SMD-BE/h. From the type 01005 up to ICs with an edge length of 70 x 70 mm, the SMD module range comprises all known types. The difficulty level of the mountable PCBs comprises NDKL up to 32-layer DKL and so-called HDI modules with BGA and µBGA on both sides.
Due to advancing miniaturization and the increasing complexity of needed circuits, the requirements on the wiring of electronic components are ever-increasing. The manufacture of HDI modules offers solutions that meet these developments. A HDI board (High-Density-Interconnect) is a highly compact circuit board with a high packing density and delicate, dense conductor path structures. We also develop and manufacture such HDI modules with high difficulty levels for various applications.
Our soldering technology comprises two plants, each with a process range of 500 mm. One plant is designed for leaded soldering with a double wave for SMD and THD components. The second plant for the unleaded soldering process is equipped with a Wörthmann wave for micro-alloyed solder.
The reflow ovens are suitable for both leaded and unleaded SMD soldering processes. Special solutions with low-melting solders are also possible.
Additionally, a rework station is available for prototype manufacturing and repair soldering. With this station, BGS and µBGA can be unsoldered or re-equipped. In doing so, the comparable soldering process is monitored via camera.
The entire production is closely coordinated with our customers. The scope of performance is clearly defined according to our customers’ wishes and can range from the mere contract manufacturing up to the included technological realisation to series maturity. Every customer can order our entire service range from development, EMC and environmental tests up to the electronics and device manufacture. The service provision from one source reduces intersection points and allows a faster product creation for our customers. The handover and delivery of the documents such as component diagrams, parts lists and production plans is agreed individually for each order. All data created or provided by us will be stored for 10 years. Non-disclosure agreements are a given.
IMG is a member of the FED (trade association Elektronik Design e.V)
The FED is a trade association for electronics design, circuit board and module production. The FED which was founded in 1992 is an established partner for the entire electronics industry and currently counts 648 members in Germany, Austria, Switzerland and other countries.